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1

Enterprise resource planning (ERP) implementation using the value engineering methodology and Six Sigma tools

Leu, Jun-Der, Lee, Larry Jung-Hsing

Journal:

Enterprise Information Systems

Année:

2016

Langue:

english

Fichier:

PDF, 1.95 MB

english, 2016

2

[IEEE 2018 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) - Bangkok, Thailand (2018.12.16-2018.12.19)] 2018 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) - An ERP-based Solution for the Supply Chain Planning of Medium-sized Global Manufacturing Company

Leu, Jun-Der, Krischke, Andre, Lee, Yi-Ping, Lee, Larry Jung-Hsing, Huang, Yi-Wei

Année:

2018

Langue:

english

Fichier:

PDF, 232 KB

english, 2018

3

[IEEE Industrial Engineering (CIE-40) - Awaji City, Japan (2010.07.25-2010.07.28)] The 40th International Conference on Computers & Indutrial Engineering - Using value engineering and TRIZ for better business process management

Lee, Larry Jung Hsing, Leu, Jun-Der

Année:

2010

Langue:

english

Fichier:

PDF, 337 KB

english, 2010

4

[IEEE 2018 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) - Bangkok, Thailand (2018.12.16-2018.12.19)] 2018 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) - A Green Vehicle Routing Method for the Regional Logistics Center

Leu, Jun-Der, Krischke, Andre, Lee, Yi-Ping, Lee, Larry Jung-Hsing, Huang, Yi-Wei

Année:

2018

Langue:

english

Fichier:

PDF, 2.26 MB

english, 2018

5

An Integrated Group Decision Making Support Model for Corporate Financing Decisions

Tsai, Wen-Hsien, Yang, Ching-Chien, Leu, Jun-Der, Lee, Ya-Fen, Yang, Chih-Hao

Journal:

Group Decision and Negotiation

Année:

2013

Langue:

english

Fichier:

PDF, 369 KB

english, 2013

6

Formation and Growth of Intermetallics in an Annealing-Twinned Ag-8Au-3Pd Wire Bonding Package During Reliability Tests

Chuang, Tung-Han, Chang, Che-Cheng, Chuang, Chien-Hsun, Lee, Jun-Der, Tsai, Hsing-Hua

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2013

Langue:

english

Fichier:

PDF, 1.42 MB

english, 2013

7

[IEEE 2015 2nd International Conference on Information Science and Control Engineering (ICISCE) - Shanghai, China (2015.4.24-2015.4.26)] 2015 2nd International Conference on Information Science and Control Engineering - Implementation of Enterprise Resource Planning Using the Value Engineering and System Dynamics Methods

Lee, Larry Jung-Hsing, Leu, Jun-Der, Huang, Yi-Wei

Année:

2015

Langue:

english

Fichier:

PDF, 222 KB

english, 2015

8

[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Enrichment of annealing twins in an Ag-4Pd bonding wire for electronic packaging

Chuang, Chien-Hsun, Tsai, Chih-Hsin, Lee, Jun-Der, Tsai, Hsing-Hua

Année:

2015

Langue:

english

Fichier:

PDF, 1.18 MB

english, 2015

9

Preoconcentration of nickel-63 in sea water for liwuid scintillation counting

Jem-Mau Lo, Bor-Jen Cheng, Chia-Lian Tseng, Jun-Der Lee

Journal:

Analytica Chimica Acta

Année:

1993

Langue:

english

Fichier:

PDF, 436 KB

english, 1993

10

Preconcentration of trace metals in sea water matrix for differential pulse anodic stripping voltammetry

Jun-Der Lee, Jem-Mau Lo

Journal:

Analytica Chimica Acta

Année:

1994

Langue:

english

Fichier:

PDF, 699 KB

english, 1994

11

A rapid method for the determination of 137Cs in environmental water samples

Chuarn-Yuh Huang, Jun-Der Lee, Chia-Lian Tseng, Jem-Mau Lo

Journal:

Analytica Chimica Acta

Année:

1994

Langue:

english

Fichier:

PDF, 473 KB

english, 1994

12

Determination of 60Co in environmental water samples by a hydrous magnesium oxide filter

Jem-Mau Lo, Jun-Der Lee

Journal:

Analytica Chimica Acta

Année:

1996

Langue:

english

Fichier:

PDF, 293 KB

english, 1996

13

Dithiocarbamate Extraction and Au(III) Back Extraction for Determination of Mercury in Water and Biological Samples by Anodic Stripping Voltammetry

Lo, Jem-Mau., Lee, Jun-Der.

Journal:

Analytical Chemistry

Année:

1994

Langue:

english

Fichier:

PDF, 733 KB

english, 1994

14

Effects of Annealing Twins on the Grain Growth and Mechanical Properties of Ag-8Au-3Pd Bonding Wires

Tung-Han Chuang, Chih-Hsin Tsai, Hsi-Ching Wang, Che-Cheng Chang, Chien-Hsun Chuang, Jun-Der Lee, Hsing-Hua Tsai

Journal:

Journal of Electronic Materials

Année:

2012

Langue:

english

Fichier:

PDF, 617 KB

english, 2012

15

Thermal stability of grain structure and material properties in an annealing-twinned Ag–8Au–3Pd alloy wire

Chuang, Tung-Han, Wang, Hsi-Ching, Tsai, Chih-Hsin, Chang, Che-Cheng, Chuang, Chien-Hsun, Lee, Jun-Der, Tsai, Hsing-Hua

Journal:

Scripta Materialia

Année:

2012

Langue:

english

Fichier:

PDF, 454 KB

english, 2012

16

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging

Tsai, Hsing-Hua, Lee, Jun-Der, Tsai, Chih-Hsin, Wang, Hsi-Ching, Chang, Che-Cheng, Chuang, Tung-Han

Année:

2012

Langue:

english

Fichier:

PDF, 1.50 MB

english, 2012

17

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - High performance Ag-Pd alloy wires for high frequency IC packages

Tsai, Hsing-Hua, Chuang, Tung-Han, Lee, Jun-Der, Tsai, Chih-Hsin, Wang, Hsi-Ching, Lin, Hsin-Jung, Chang, Che-Cheng

Année:

2013

Langue:

english

Fichier:

PDF, 1.12 MB

english, 2013

18

Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing

Chuang, Tung-Han, Lin, Hsin-Jung, Chuang, Chien-Hsun, Tsai, Chih-Hsin, Lee, Jun-Der, Tsai, Hsing-Hua

Journal:

Metallurgical and Materials Transactions A

Année:

2014

Langue:

english

Fichier:

PDF, 1.28 MB

english, 2014

19

[IEEE 2015 2nd International Conference on Information Science and Control Engineering (ICISCE) - Shanghai, China (2015.4.24-2015.4.26)] 2015 2nd International Conference on Information Science and Control Engineering - A Value Engineering Based Method of Configuring ICT-Based Customer Service Centers

Lee, Larry Jung-Hsing, Leu, Jun-Der, Huang, Yi-Wei

Année:

2015

Langue:

english

Fichier:

PDF, 251 KB

english, 2015

20

Thermal stability of grain structure and material properties in an annealing twinned Ag–4Pd alloy wire

Chuang, Tung-Han, Lin, Hsin-Jung, Chuang, Chien-Hsun, Shiue, Yu-Yun, Shieu, Fuh-Sheng, Huang, Yen-Lin, Hsu, Po-Chun, Lee, Jun-Der, Tsai, Hsing-Hua

Journal:

Journal of Alloys and Compounds

Année:

2014

Langue:

english

Fichier:

PDF, 2.54 MB

english, 2014

21

Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages

Tsai, Chih-Hsin, Chuang, Chien-Hsun, Tsai, Hsing-Hua, Lee, Jun-Der, Chang, Dennis, Lin, Hsin-Jung, Chuang, Tung-Han

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2016

Langue:

english

Fichier:

PDF, 2.32 MB

english, 2016

22

[IEEE 2016 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) - Bali, Indonesia (2016.12.4-2016.12.7)] 2016 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) - A regression-based approach to identifying factors affecting operational efficiency in surgical rooms

Leu, Jun-Der, Lee, Larry Jung-Hsing, Huang, Yi-Wei

Année:

2016

Langue:

english

Fichier:

PDF, 2.56 MB

english, 2016

23

[IEEE 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2014.10.22-2014.10.24)] 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Applications of Ag-alloy stud bump for IC and LED packages

Tsai, Hsing-Hua, Tsai, Chih-Hsin, Lee, Jun-Der, Chang, Dennis, Shih, Yu-Ting, Chen, Chun-Hao, Chuang, Tung-Han

Année:

2014

Langue:

english

Fichier:

PDF, 1.55 MB

english, 2014

24

Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires

Kuo, Bing-Hau, Tsai, Du-Cheng, Huang, Yen-Lin, Hsu, Po-Chun, Chuang, Tung-Han, Lee, Jun-Der, Tsai, Hsing-Hua, Shieu, Fuh-Sheng

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2019

Langue:

english

Fichier:

PDF, 3.32 MB

english, 2019

25

Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires

Kuo, Bing-Hau, Tsai, Du-Cheng, Huang, Yen-Lin, Hsu, Po-Chun, Chuang, Tung-Han, Lee, Jun-Der, Tsai, Hsing-Hua, Shieu, Fuh-Sheng

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2019

Fichier:

PDF, 3.32 MB

2019

26

Value Engineering-Based Method for Implementing the ISO14001 System in the Green Supply Chains

Leu, Jun-Der, Lee, Larry Jung-Hsing, Krischke, André

Journal:

International Journal of Strategic Decision Sciences

Année:

2016

Fichier:

PDF, 1.38 MB

2016

27

Exploring the Effectiveness of IT Application and Value Method in the Innovation Performance of Enterprise

Lee, Larry Jung-Hsing, Leu, Jun-Der

Journal:

International Journal of Enterprise Information Systems

Année:

2016

Langue:

english

Fichier:

PDF, 603 KB

english, 2016

28

Au-induced improvements in the grain stability and mechanical properties of Ag-based alloy wires under electrical current stressing

Kuo, Bing-Hau, Tsai, Du-Cheng, Huang, Yen-Lin, Hsu, Po-Chun, Chuang, Tung-Han, Lee, Jun-Der, Tsai, Hsing-Hua, Shieu, Fuh-Sheng

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2019

Langue:

english

Fichier:

PDF, 4.53 MB

english, 2019

29

[IEEE 2019 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) - Macao, Macao (2019.12.15-2019.12.18)] 2019 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) - How to Achieve the Supply Chain Performance of Small and Medium-Sized Enterprises?

Leu, Jun-Der, Huang, Yi-Wei, Lee, Larry Jung-Hsing

Année:

2019

Fichier:

PDF, 1.53 MB

2019